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NMX-J-191
1 g7 c+ O. @3 ]1 _; gHeat Deformation of Semiconductive Shielding, Insulations and Protective Coverings of Electrical
* G+ ]. A8 C0 D4 mConductors – Test Method
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5.1.3 Deformation3 N9 J( p5 y, X, P" \6 [+ r; q9 C' ^# U
5.1.3.1 Insulation& S- ^' x* w- b
The insulation on single-conductor wires, and on the individual conductors (separated, in the case of7 g: a$ _( Y. \5 w( S$ x7 q
parallel cords), shall not decrease by more than 50% in thickness when subjected to a force caused by a( ]4 d5 y1 W. v6 p' E
mass as shown in Table 40, and while maintained at the temperature shown in Table 40 for 1 h.
0 ]8 c* v: q. y6 V5.1.3.2 Jacket; u: }( D, z" ^ k& h+ e5 y
Smoothed specimens of jackets from finished cords and cables shall not decrease by more than 50% in
" }1 N0 Z- }- _8 `5 n2 Cthickness when subjected to a force caused by a mass of 2000 g, and while maintained at the temperature
9 U( G) ]. g9 r' c2 _6 ?shown in Table 40 for 1 h.
3 u8 u# Y+ A8 c( a# X) U4 [5.1.3.3 Method
+ w8 p$ d0 }& `. {Compliance with Clauses 5.1.3.1 and 5.1.3.2 shall be determined in accordance with the method
' {$ B1 p) {6 G0 Q# ?+ N4 b5 P& qdescribed in CSA C22.2 No. 0.3, Clause 4.3.6.1; UL 1581, Section 560; or NMX-J-191-ANCE.9 _- z: A) L0 V
8 Z+ W# m0 {: r. Z3 l, rUL62里有要求做此测试的电线型号里,没有SVOO的型号! |
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