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以下我觉得描述比较正6 i8 d0 B# b# m( U
Enclosure, inner surface, near T27 l" t, K" @( ^+ S2 t
Enclosure, inner surface, near Q1
( E" w2 u+ b7 f9 t# n! [/ QEnclosure, inner surface, near BR11 K% u& G" R0 T; q7 n
Diffuser Cover, nearest to heatsink
8 j$ q, M" z& j7 t" d' TDiffuser, inside, near LED; r% H( F. w7 x% M+ D
Input lead, near L1. u! Q# `4 W8 u
Output lead, near to LED / T2) C6 h& p+ h- X; p: h
Connector, near LED
1 n" `8 {% G$ E9 Q9 t& kLED board, near center LED6 i, a% N0 ]) g7 t) C% a- m2 ?
PWB foil trace side, f1 p4 u- }) }) O9 P( f8 s3 y3 n* d! r
T1 winding& m# B+ Q5 _5 A G1 S+ |8 v
L1 winding4 o. ^& N, a8 e2 [9 S8 e6 u1 }
L3 winding
' X, R2 t0 ^) D4 {/ W, ^IC1
8 M4 B5 `. C) c8 Y0 YCapacitor CX2
! ^4 N- C$ k; L. G+ C: OCapacitor CY19 h/ G# b2 b7 o, i9 m9 p
Capacitor CY2
: {" y# u z, N: TInsulation, contact heatsink
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