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这是我上次做的一个LED球泡灯的UL目击测试温点。
0 C; Z: [. p" Y/ t8 R+ j- [% nLamp base center, inside(represent for lamp base enclosure temperature)
2 U8 t! ]" F9 m7 e8 ?Lamp base holder, near to transformer
1 q/ R: ]7 s1 f; bT1
$ k# K. R0 I$ {1 ? OInsulation sheet, at bottom side of heat sink, near the bottom of LED package
9 @4 Q( s8 f6 L! l+ }( T, A FTop Cover, near the heat sink5 @# v4 W& n) [
Glue of the between the Top Cover and Front Ring Cover x7 t% }7 w9 W( ]
Heat Sink, outside, contact surface$ H5 C" N4 n; J* b- w6 V5 b
Potting Compound
/ f u& y5 C8 T( [+ U0 }; ]LED driver :8 @ V$ w: k( S8 e! Q# W6 X) B1 l
Bobbin of Transformer (T1)
. Y5 c# K# k; @2 V# n6 s7 DCoil of Transformer (T1)! ^3 S! V& f9 E" {
Multi-layer insulated wire 7 n2 X0 o' z, F# J7 a4 {4 u
Coil of Inductor (L1): c: V$ ?+ Q, z d" ?) b1 y
Body of Inductor (L1), near Q1* a+ s. S1 l" [0 B% c9 U
Fuse F1
! v( F/ Q0 X) P- HC1 body9 x8 V3 J3 B0 Y$ _( Q; h+ H
C2 body, near Q19 { Q5 i) }5 \
CY1 body, Q0 J- O3 q8 m( X0 K/ ~+ _
Varistor (MOV)
9 E: j$ r) p; Q) k/ T3 `+ |Output Lead of LED Driver, near the LED package
5 S( z; H; Z" C- wPWB, top layer, near T1
3 c0 F& B4 [6 p' d" }( V# z" sPWB, bottom layer, near T1 4 r1 P4 D' m: k# l& q8 ^
PWB, top layer, near Q1
3 a( Q# `2 v, C {% j5 u y/ fLED board:
& G+ F8 c, F R/ d VPWB, near LED package
/ g9 s$ @( f. \# Q% {$ t |
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