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以下我觉得描述比较正
+ t! G9 ?4 ]5 O- ]Enclosure, inner surface, near T2
8 K0 d* [1 n1 m: d0 H4 n+ fEnclosure, inner surface, near Q1
7 s. e7 P7 |, |$ {9 PEnclosure, inner surface, near BR1
) ?- L' C: _. FDiffuser Cover, nearest to heatsink! U# a* D8 s3 m
Diffuser, inside, near LED0 r, A- W) b1 x/ P4 K9 \
Input lead, near L1' J2 l7 Q4 h& J. \
Output lead, near to LED / T2 ^! }' ]6 p3 n; I
Connector, near LED+ C" }1 u) r+ A4 a9 T( ~6 R/ V
LED board, near center LED# A% G, H. U- j; o4 N; A$ O h
PWB foil trace side
( I' t% H. Y- [5 R9 i* D0 a* DT1 winding9 Z) D6 i3 P9 ~3 I7 J
L1 winding
& O \+ l$ C- }' ML3 winding5 a+ }' [3 j: w3 c" \. u
IC1
: x* Q, V3 m% o0 m- OCapacitor CX26 f: }1 I" e$ I7 }( E9 g+ Z2 |
Capacitor CY19 O5 l* d0 p4 ~8 C
Capacitor CY2
g" P; @+ h1 z1 r0 h# M3 V+ Y$ l$ tInsulation, contact heatsink) _% R; M& V; m
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