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以下我觉得描述比较正
; f" o: L; W& @, F; U& H4 E4 [Enclosure, inner surface, near T2
6 _) n& |9 J% D6 g2 dEnclosure, inner surface, near Q1 y( s3 c0 M, V, ~+ t' d
Enclosure, inner surface, near BR1& h9 e" n( E7 p, n
Diffuser Cover, nearest to heatsink- {1 X* `! m8 W( F; J5 j# N; R' _
Diffuser, inside, near LED
! t. @) `+ Q) q; r% [% y3 m7 uInput lead, near L1
$ b. ^2 t3 d7 R+ H$ g6 o" j5 GOutput lead, near to LED / T2
# d8 Y& o/ x4 O( M) ~Connector, near LED
+ c: d/ W# T1 U0 dLED board, near center LED
8 @0 ]+ R/ ~# S3 O) h0 m/ IPWB foil trace side0 W. l, g0 z8 f' U Y% k k
T1 winding. W/ T) t; F/ F* p: g& J
L1 winding- V {+ Z( M( n7 y
L3 winding$ F9 a0 A% p3 \3 K' A. M
IC13 b; L. ~" P3 K" F
Capacitor CX2
0 n' A+ l: W' X9 n3 YCapacitor CY1& {0 f: v, F- Y6 v8 K) I
Capacitor CY2& N" O' i H- [; w9 O w7 F8 d
Insulation, contact heatsink
9 w9 t* u9 J+ E* m+ v9 S; ^* i |
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