|
|
以下我觉得描述比较正2 a5 Q$ c" F4 l+ j, P5 F# i3 ?1 r$ }
Enclosure, inner surface, near T2) O/ y7 q& V6 A& P+ K
Enclosure, inner surface, near Q1
) Y* j7 P8 f. b6 ]5 Y7 t. jEnclosure, inner surface, near BR1
% T& l; Z! G% y" lDiffuser Cover, nearest to heatsink
+ T% m; P2 F WDiffuser, inside, near LED4 S9 A8 ~; P1 l8 U5 ~
Input lead, near L1" ]: z N% ?& Q T1 J4 z+ D
Output lead, near to LED / T2
" p' f) S6 ^: Q' r' f/ f, wConnector, near LED1 D. f3 }# b' y1 s9 W7 ]4 v3 @/ `
LED board, near center LED- ?; u# n6 y4 D) f) m" u- i4 t
PWB foil trace side4 C0 m' [/ d3 a- i. M" ?
T1 winding
. h5 d+ X" Q$ M8 FL1 winding
: i. C' u* b+ I/ J1 }) gL3 winding
1 _, A0 Y: y' {2 m, T/ z! [* W+ bIC1
) g3 e( s# j( d. J. L) d b/ DCapacitor CX2
4 m( B# q0 f* a/ k& T0 a- jCapacitor CY1( R7 P1 n2 [6 y N8 h: V
Capacitor CY2
3 {( y; J, T0 ]' q( F; S/ bInsulation, contact heatsink
5 Q) p( T, Z" A8 K |
|