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这是我上次做的一个LED球泡灯的UL目击测试温点。
4 W/ D9 o2 g9 jLamp base center, inside(represent for lamp base enclosure temperature)
& H6 w8 D5 k# g! s$ yLamp base holder, near to transformer 2 M/ C/ x$ ?0 R% ~0 {4 B. }
T1 4 ^ C1 X0 W. T! m
Insulation sheet, at bottom side of heat sink, near the bottom of LED package
) H; {; n% ^- J7 E* W: \Top Cover, near the heat sink3 C$ M: I( ~& R
Glue of the between the Top Cover and Front Ring Cover ; Z0 ^+ I; v' P; k3 d/ o' |+ c
Heat Sink, outside, contact surface' x2 ~: Z" S3 ~9 e- h% `9 b: P
Potting Compound' d; _. ^6 U. ?" T3 y
LED driver :0 R: D: w4 \6 ~! g
Bobbin of Transformer (T1)+ Z* L4 v: L) W7 a5 G1 |" p, q+ I
Coil of Transformer (T1)) ?( L% j- G }) \: l& Z p
Multi-layer insulated wire 2 m' ~! i( R; E0 U; A5 t2 S5 K
Coil of Inductor (L1)
3 m/ A0 @4 x" p" p4 QBody of Inductor (L1), near Q1- _7 r5 v# z U
Fuse F1
( p: O, m: i6 b+ ^: |' UC1 body
6 \4 ~, K: d7 k* }6 s+ [- `C2 body, near Q1: m0 X3 D, e7 f& b* ?8 c
CY1 body6 A, } j/ s- p# d5 X+ _: x
Varistor (MOV)
; p( W: m t% K9 h4 LOutput Lead of LED Driver, near the LED package. a( O' ?, n$ ~$ i. R* H% e+ y
PWB, top layer, near T1
7 P) G) g1 P9 }1 @! ePWB, bottom layer, near T1
# X& J' U; u8 y# c; F2 i& E( jPWB, top layer, near Q1' h& N4 \( h6 j
LED board:4 y4 f8 L( U. y( ?7 K
PWB, near LED package* A8 x) A5 E6 y7 O4 y" C6 F' y
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