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peter, 决议原文如下:, g: h7 Y8 h: w- {
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9 d; L+ H8 z. C X+ I$ m4 l% I. s1 zOSM/EE DECISION SHEET" ]% l; k( V/ u' f- u0 _" R
4 S/ p! @. D. `6 M( w7 D) pStandard: ( T* q- H9 m; k' H
EN 60950:2000
4 Y. ~' V& {( {) y! a, [EN 60950-1 :2001 Sub clause:
2 A0 ~! p7 t6 C7 |; F7 k; I2.10.5 Sheet no. :
* I4 v" ^4 \: C1 L3 d$ ]! T! q7 M/ K 95/17
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Page: 1 of 1/ U8 j. ~: d: |+ z& T/ J* h
Subject:
" B( s& ?6 A+ N( j; q* fInsulation of plastic enclosure of semiconductor component Key words:
0 d+ f2 @6 A( a1 ~# h( E5 XSemiconductor insulation Meeting:
A; i" _7 M7 _( `) ~% {OSM/EE - 1995* U4 \4 _9 S( ?( k& j) `
Item 9.143 E' P' L" \6 \1 x. U; K
5 D2 |3 i) Q/ N3 C9 S9 YQuestion: 9 ~, [: r6 x. ?- k- ?7 h+ ?+ |
Type of insulation of plastic enclosure of semiconductor component. M" G& s# }0 s& x' r6 P
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Decision:
0 O$ g, B2 q$ H# \/ ] _The plastic enclosure of a semiconductor can be considered as basic insulation. These components including alternatives must be listed in the list of critical components and there must be a remark in the service documentation.
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0 I0 T4 i7 |$ c* M) FExplanatory Notes: - |
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