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peter, 决议原文如下:
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+ R2 S% p" E* G! Q4 tOSM/EE DECISION SHEET
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6 n8 t- G2 x5 q; W: _Standard: $ v) d) a5 ^' ]
EN 60950:2000. F# Q% B. Q r- L8 Z- r* e, d
EN 60950-1 :2001 Sub clause: 0 l+ g q. B2 G* e0 g3 X6 a C3 q
2.10.5 Sheet no. :* w" b+ f2 |" ^6 r- P8 n9 k
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Page: 1 of 1# g: c+ K% ]( W% o
Subject:
0 L+ x# P5 S3 V$ A1 mInsulation of plastic enclosure of semiconductor component Key words:
! R" @# f6 I/ {4 ^0 F* \Semiconductor insulation Meeting: : s9 s1 T3 P+ d- S% Z5 @
OSM/EE - 1995
1 k O }: V* D6 _& fItem 9.148 S! p+ P3 H3 }7 @6 T) M- B, [
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Question: ! N& M+ F% d6 S% B. n
Type of insulation of plastic enclosure of semiconductor component9 l' c" Z, Q) K
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Decision:+ e. ^0 r, N$ W3 g
The plastic enclosure of a semiconductor can be considered as basic insulation. These components including alternatives must be listed in the list of critical components and there must be a remark in the service documentation.+ l7 F- n- a' b" U5 A& Z N6 u
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Explanatory Notes: - |
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