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| DSH 380
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6 R! L A" |' S; L- j | Affect of solder resist on Comparative Tracking Index (CTI) of Printed Wiring Boards
8 z- [* e7 j" [0 I. C | 2.9.3, Table 6, Condition 3
. e# C0 ]2 ?* X | 60950(ed.2) & 60950(ed.3)$ Y+ z m8 L% N+ _
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1 u5 h* `! s: M6 H7 d5 xStandard:6 p* A7 J3 Y0 _
IEC 60950, 2nd and 3rd Ed.
) B' \0 e+ s) l0 x \% u qSub clause:
( U, {5 W- l( F7 l. D2.9.3, Table 6, condition 3
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Page 1 (1)
$ s+ t d3 k. Z) u, N, NSubject:" s# }" \7 \4 q2 d9 G5 P- z. ]
Affect of solder resist on) K7 R' I& \& k y' ?
Comparative Tracking Index (CTI)
. F- J8 r0 X6 X: @3 r, Yof Printed Wiring Boards m! S! z I# t% X" ]5 O) _
Key words:2 p6 v2 V8 ]5 E1 h
-comparative tracking index$ e" t5 C+ j; g. E: O- ^
-CTI
* ^9 F; r6 r: H: u-printed wiring boards. O9 }% G/ m9 Z: [8 S+ p
-PWB
: \/ j* u* A7 |7 s1 }6 N# V-solder resist& C3 g. j% u& T$ [9 j1 {6 F
Decision confirmed
+ a; I0 e2 t4 s2 K& iat CTL 38th meeting0 Y# q: }1 ~& M/ N
Question:
3 e* \% G5 S5 A A0 o4 V- Y0 VThe measured Comparative Tracking Index (CTI) for a printed wiring board with solder- I% w# N; }2 E1 ]( S
resist present can be different than that for the printed wiring board without the solder resist.6 i$ \2 ?# H2 ~7 Y
The creepage distances required in the standard depends upon the CTI for the printed wiring! d4 N: ]' z, Y3 x g, @
board.
$ b3 p8 @( l8 T O9 Q9 i+ s. H3 W$ o. ^Should the presence of solder resist on a printed wiring board be considered in determining
& L u0 U+ E* Sthe CTI when determining the creepage distances requirements to be applied?
* j& P; z& {4 A8 nNote – Clause 2.9.5 does not apply to this question because the assembled printed wiring) C9 ]* K! y- k, j1 v6 Y" m% V
board is not covered with a conformal coating.( R! q1 b, {: S1 h
Decision:2 C4 J7 h! O* Z* q. i9 w
Yes.
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