DSH 380 Affect of solder resist on Comparative Tracking Index (CTI) of Printed

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DSH 380 % B8 ], s( n0 J: N

Affect of solder resist on Comparative Tracking Index (CTI) of Printed Wiring Boards 0 B7 b4 s. `/ W, W% p* E

2.9.3, Table 6, Condition 3 9 B; }# b/ i4 e' E' i% v

60950(ed.2) & 60950(ed.3) - p" f( n7 o: o! g

8 q- G. o2 f- S7 P) f. KStandard:
IEC 60950, 2nd and 3rd Ed.
( w- V6 O+ |& m7 r) {( v; RSub clause:
3 E, [) ^$ N/ ?  u% s4 a2.9.3, Table 6, condition 3
. I4 d6 n" x9 [' a. NSheet n. 380
Page 1 (1)
) h# |  D% F! Y5 @, N2 Z7 t; J) J* W- ZSubject:
Affect of solder resist on
Comparative Tracking Index (CTI)
) }# a: f% U/ }9 R, f0 i0 J: nof Printed Wiring Boards
. d1 o: P2 |; @4 j. e* Y. wKey words:
* S4 j1 `5 h& v4 ~; H-comparative tracking index
5 C& ]% R- v) n4 A9 k: c- r-CTI
1 J/ ]/ ]8 A( [8 X' m& {* [' d$ \-printed wiring boards
  b! k9 T, i+ A+ ^# I3 z; T-PWB
-solder resist
! o+ C% q: f  m# d2 sDecision confirmed
# d9 [- D5 z( I: u, f0 j" Z' |at CTL 38th meeting
Question:
The measured Comparative Tracking Index (CTI) for a printed wiring board with solder
( s1 G$ c7 D2 v( F: Kresist present can be different than that for the printed wiring board without the solder resist.
The creepage distances required in the standard depends upon the CTI for the printed wiring
board.
0 d' F9 |- g  T) j+ |+ VShould the presence of solder resist on a printed wiring board be considered in determining
% i& A$ B. Q% r0 J' Q. n" Uthe CTI when determining the creepage distances requirements to be applied?
! a" i( Z" Z, vNote – Clause 2.9.5 does not apply to this question because the assembled printed wiring
board is not covered with a conformal coating.
% ~6 L7 C3 W2 l: l) @7 CDecision:
Yes.
) W) X& x1 b' V' r# y0 |
0 H5 D$ D7 B1 p3 T" l) M
+ m7 J" Z& L3 P0 r9 [