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7.1.1 Where there is sufficient space as defined in 7.1.2, each FMIC shall be plainly and permanently* V% X( C6 K4 \
marked, such as by etching, printing, solder mask marking, or nonconductive ink printing or screening,. p* @& x7 D; v; i$ n. ]. e. ^4 q S+ i
with the manufacturer’s name, trademark, or authorized initials or symbols by which the organization
' r( }! R6 g0 l- }3 aresponsible for the FMIC shall be identified, followed by a Type designation, or code number or equivalent
" S( C$ E/ v; S ?" [1 Y5 a) Hdesignation to indicate the FMIC has been tested for flammability, and where applicable, a combination of
$ `7 i0 o8 V E. n9 K% F, \bond strength, conductive paste adhesion, plating adhesion, cover material, (ambient) bend, cold-bend,# Z5 h" `% p0 y+ z9 D9 p
and repeated flexing. Conductive markings, such as etched copper, shall be considered as electrical- R& D% i0 D; d. V) r
elements (unconnected conductive part) of the circuit and shall not reduce the electrical spacing3 B' C* |' l7 l- ?0 T* k: ^
requirements for the end product.
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7.1.2 Sufficient space is defined as a space at least 2.5 mm (0.1 inch) high and of sufficient length to accommodate the marking. When there is insufficient space to accommodate the marking, the marking shall be marked on the smallest unit container. The marking may be marked on the panel frame to which the FMIC is attached, if the FMIC will remain in the panel construction when shipped to the OEM.
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7.1.2很关键。
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发表于 2012-3-27 09:43
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发表于 2012-3-27 12:24
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