DSH 380 Affect of solder resist on Comparative Tracking Index (CTI) of Printed

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DSH 380 & {* H6 ?. u% w- t( p- e

Affect of solder resist on Comparative Tracking Index (CTI) of Printed Wiring Boards

2.9.3, Table 6, Condition 3 " p% W: ?* k) C# Q# g9 I3 `' d5 x: f8 f

60950(ed.2) & 60950(ed.3)

: W; c/ ~- W6 m0 O8 H) w$ a& V4 D7 FStandard:
IEC 60950, 2nd and 3rd Ed.
Sub clause:
2.9.3, Table 6, condition 3
Sheet n. 380
Page 1 (1)
Subject:
Affect of solder resist on
Comparative Tracking Index (CTI)
2 s  C% Y- o; q0 c1 D/ fof Printed Wiring Boards
Key words:
-comparative tracking index
7 O; q) X7 y% L-CTI
8 M; ^4 {: T* B1 l/ y0 Y+ |-printed wiring boards
. V0 E# c$ f9 h# l5 F9 T" P) C-PWB
-solder resist
Decision confirmed
at CTL 38th meeting
Question:
The measured Comparative Tracking Index (CTI) for a printed wiring board with solder
resist present can be different than that for the printed wiring board without the solder resist.
" [: @! I4 U  I8 i  mThe creepage distances required in the standard depends upon the CTI for the printed wiring
- R  U4 I7 ?5 G2 Mboard.
Should the presence of solder resist on a printed wiring board be considered in determining
/ e& ]7 b: K  ]the CTI when determining the creepage distances requirements to be applied?
/ F0 R  p7 l; e, j  G0 B+ ZNote – Clause 2.9.5 does not apply to this question because the assembled printed wiring
board is not covered with a conformal coating.
. B  {, U  p' t2 PDecision:
Yes.
- O; r# z  p+ b# t2 C
0 D6 X# y/ a. B! {. q7 X! N
9 Z5 N7 Q7 d# {