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peter, 决议原文如下:
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OSM/EE DECISION SHEET/ T2 s3 W5 ?2 u* \: @6 U+ W6 ]
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Standard: ) Z- y* B0 s% ]0 X
EN 60950:2000# _1 n. o% m8 o# c. p+ x! ^
EN 60950-1 :2001 Sub clause:
( X- W! v# a9 ]. k2.10.5 Sheet no. :# v/ o `- N; m
95/177 {# w! V) o2 \5 j( S
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Page: 1 of 1) w% [+ Q, l% {6 }( E- j+ U
Subject:
) q2 K; p7 F j* E- m4 @" aInsulation of plastic enclosure of semiconductor component Key words: Y: m ?! W- K0 `# d6 v4 |
Semiconductor insulation Meeting: 7 L8 b- ^+ T8 V/ V8 M; s! H
OSM/EE - 1995
% U5 m e' g: {! l# F! S0 hItem 9.14
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1 @5 Q* [+ Y5 O' s# [0 kQuestion:
/ g! ?/ k% F/ c) }5 W( ^2 i1 ]( `1 O! CType of insulation of plastic enclosure of semiconductor component; _$ v0 K. V: m& n- Y* B! {
: y9 H! i' B/ W3 CDecision:
' r6 U0 p. D6 p; l2 D R+ F$ _0 d$ qThe plastic enclosure of a semiconductor can be considered as basic insulation. These components including alternatives must be listed in the list of critical components and there must be a remark in the service documentation.
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. p2 H$ o2 o: [2 s# V( o$ ]Explanatory Notes: - |
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