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这是我上次做的一个LED球泡灯的UL目击测试温点。
& @- \ y( c; ^1 FLamp base center, inside(represent for lamp base enclosure temperature)
0 \: M. W9 c/ \# c% Y! a: RLamp base holder, near to transformer $ V) m) u, i; C# d
T1
. @2 [/ `( d k. r+ @0 u. SInsulation sheet, at bottom side of heat sink, near the bottom of LED package
% X% [. v$ D9 h3 h7 e: nTop Cover, near the heat sink
$ k! T% c! D* C- W! D7 x4 ^Glue of the between the Top Cover and Front Ring Cover
J) w" ?; _ O3 C9 qHeat Sink, outside, contact surface* X" X+ K! l9 z! K
Potting Compound) [9 r- G/ D* _7 |) E: W+ u
LED driver :% X+ C6 c% \- G8 \- W/ ]
Bobbin of Transformer (T1)
4 G9 d6 f9 N5 d& J+ ^9 d" X/ mCoil of Transformer (T1)
- p( m0 {* ^+ A$ k* i% m) W+ lMulti-layer insulated wire 3 g( {1 Q( |' t* g4 x! ?
Coil of Inductor (L1)9 h+ b/ i5 g. p# G3 y
Body of Inductor (L1), near Q1
) Q0 N7 d% B' TFuse F1
% H+ a/ F% d W3 cC1 body/ G, F) ~& c B e
C2 body, near Q1. Z1 ~9 T6 n( O$ i, _$ ]. M4 i
CY1 body! B/ E. h0 p2 P$ \1 D
Varistor (MOV)
0 u$ |+ c7 C, Q6 p1 L' E8 M) hOutput Lead of LED Driver, near the LED package8 j d- ?& B. n, ?, k- a
PWB, top layer, near T1
0 q8 k: S k4 T5 L. |PWB, bottom layer, near T1
}# d# I+ a, L; D" L4 gPWB, top layer, near Q1/ m/ c: g$ L9 _
LED board:
R1 {" U$ j# I$ V8 B) [$ oPWB, near LED package
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