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9 ~9 ~9 U- W$ E8 d/ U" A
Standard:* ~# `/ [: l: V5 r& e" e
IEC60950, 3rd Ed.
6 v$ s+ n9 ], v1 o+ iSub clause:# Y0 q, C% x% U& ]$ [) X2 @2 Q) q
2.9.1 and 2.9.27 y6 S9 O: d- V. z5 g
Sheet n. 373- r* v" i( K2 q7 \/ x
Page 1 (1)( H* l9 P, y! a
Subject:
( ^% S% }6 q" [4 i7 qHumidity conditioning
f9 g5 z* Y3 U$ b# SKey words:+ {1 V0 U& S' v O7 C
-Insulation% K8 s& f. G8 h" N2 E7 M( P% ?0 J7 S% _
-Humidity
) C' U/ y" P/ m: }Decision confirmed
. y$ I8 M# C" ~' j3 ` m. u; Wat CTL 38th meeting
6 ?- y, V7 S7 m2 M; yQuestion:
6 P4 p" y T5 B( n4 c9 [Sub-clause 2.9.1 specifies that " the component or subassembly" be subjected to the
$ B$ w: P" P) t" ~% [0 Chumidity treatment of 2.9.2. Sub-clause 2.9.2 specifies that " during the conditioning the
$ e$ P# F, \; l; Ocomponent or subassembly is not energized".
# N# j, u% n9 R7 tCan these requirements be interpreted in the way that only components and subassemblies$ s: s ?, }+ ^1 B0 Z
need to be subjected to the conditioning and not the equipment where these components! \0 u* I3 d% m( i6 {4 B
and/or subassemblies are mounted?& V. U8 i" N1 Z+ d- i/ m
Decision:: Z. b, d8 q/ e7 f. a0 q! ~) E! c
Yes.; `2 T, f7 ]* M* G3 C. s7 \
: F* h% Z# ~) U( P. q& T2 @/ Z6 b" [/ _( t( n+ e5 I( l
9 q$ x' ~$ N% S1 r2 v# v9 j) Y" }! N: G3 o( n# n: W
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