|
请教各位大佬,在LED灯中,对于非隔离电源驱动的LED灯板(使用铝基板),其结构要求LED灯板带电部件与铝基部分满足加强绝缘,那么铝基板的绝缘层是否满足加强绝缘呢?据说,铝基板的绝缘层一般也只能耐受1000V的电压。! ~- \6 y' y" e, G) n
我引用了论坛里下列帖子的12楼的回复:# v: h6 i% \/ L0 e T4 X
http://bbs.angui.org/forum.php?mod=viewthread&tid=114267&extra=&highlight=%C2%C1%BB%F9%B0%E5&page=2. x4 D- C t. e) y4 s2 n
; v' h8 r1 y* m
We must treat the metal LED carrier as a live part. The insulation between the PCB circuits and the metal carrier is only functional insulation.
. B E* C1 U" R2 mFor now, the standard knows no way to ensure that the insulation is equivalent to basic insulation.: f7 Q6 `7 H6 w/ C& d* `9 h+ d
6 d: D2 S! Z* T: M有没有哪个标准或决议里有明确说明铝基板绝缘层的绝缘判定呢?4 B! u/ X5 _. ^4 M- \7 _, n5 \
3 w. ~! p! X, z! K% m. U: {, ]4 N+ ]$ R8 x; F+ n% L
|
|