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以下我觉得描述比较正. K8 I! I/ @# Z0 I4 E' q2 k
Enclosure, inner surface, near T2
& b( A L. b) T' V9 W# f$ Q# |Enclosure, inner surface, near Q1
7 D; I ~& z) n& D3 I* uEnclosure, inner surface, near BR19 a2 V, w' Y$ h4 h5 d: G
Diffuser Cover, nearest to heatsink
* c4 y# D2 Y0 m. T2 M8 H9 x5 iDiffuser, inside, near LED
% c: d2 [$ T+ y7 ^6 ]Input lead, near L14 r* ~0 ], B, t7 u& j: a- A( Y
Output lead, near to LED / T2
2 `4 r7 h! F' j: h% H' n( M% [Connector, near LED8 j, {, c7 g& p' q; v
LED board, near center LED; Q: j8 D; Q3 y' D
PWB foil trace side
3 z, s; W* y" O# z3 p* G. R7 P& J; ZT1 winding5 d/ N+ P" ?7 U* d+ q
L1 winding) t5 Q+ q5 u: |# Z) _9 e
L3 winding2 c& d" G3 P; w4 u& n, P
IC1
, V% i& b' C# |) ?' c& TCapacitor CX25 k" e$ {7 Y; Q4 \" A1 W
Capacitor CY1* j" g: O" c2 m9 V' ?
Capacitor CY2
9 S8 R# N$ ?4 T$ N2 X2 yInsulation, contact heatsink
9 V& ~- t/ D0 W3 e. j' s# _ |
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