ROHS最新豁免清单
RoHS指令豁免项目Exempted Items of RoHS Directive
欧盟委员会针对豁免材料陆续发布了8次决议,分别是：2002/95/EC、
2005/717/EC、2005/747/EC、2006/310/EC、2006/690/EC、2006/691/EC、2006/692/EC、
2008/385/EC和2009/443/EC，这些决议中的豁免共计38 项：
1. Mercury in compact fluorescent lamps not exceeding 5 mg per lamp.
小型荧光灯中的汞，汞含量不超过5mg/灯。
2. Mercury in straight fluorescent lamps for general purposes not exceeding:
普通用途直荧光灯中的汞，汞含量不超过：
·Halophosphate 10 mg；
盐磷酸盐10mg；
·Triphosphate with normal lifetime 5 mg；
普通寿命的三磷酸盐5mg；
·Triphosphate with long lifetime 8 mg；
长寿命的三磷酸盐5mg；
3. Mercury in straight fluorescent lamps for special purposes.
特殊用途直荧光灯中的汞
4. Mercury in other lamps not specifically mentioned in this Annex.
本附录未明确提出的其他灯具中的汞
5. Lead in glass of cathode ray tubes, electronic components and fluorescent tubes.
阴极射线管，电子元件以及荧光管的玻璃中的铅
6. Lead as an alloying element in:
铅作为合金元素在：
· Steel containing up to 0.35 % lead by weight;
钢里，铅的重量含量不超过0.35 %
· Aluminium containing up to 0.4 % lead by weight;
铝里，铅的重量含量不超过0.4%
· Copper alloy containing up to 4 % lead by weight.
铜合金里，铅的重量含量不超过4%
7. Lead in high melting temperature type solders (i.e. lead-based alloys containing
85 % by weight or more lead).
用于高温融化焊料中的铅（即：锡铅焊料合金中铅含量超过85%）
· Lead in solders for servers, storage and storage array systems, network infrastructure
equipment for switching, signaling, transmission as well as network management for
telecommunication.
用于服务器，存储器和存储系统中的铅，用于交换，信号和传输，以及电信网络管理的网 络基
础设施设备中焊料中的铅。
· Lead in electronic ceramic parts (e.g. Piezoelectronic devices).
电子陶瓷产品中的铅（如：高压电子装置）
8. Cadmium and its compounds in electrical contacts and cadmium plating except for applications
banned under Directive 91/338/EEC amending Directive 76/769/EEC relating to restrictions
on the marketing and use of certain dangerous substances and preparations.
根据修改关于限制特定危险物质和与制品销售和使用的第76/796/EEC号指令的91/338/EEC 号指令
禁止以外的镉电镀。
9. Hexavalent chromium as an anti-corrosion of the carbon steel cooling system in absorption
refrigerators.
在吸收式电冰箱中作为碳钢冷却系统防腐剂的六价铬。
9b Lead in lead-bronze bearing shells and bushes.
9b 用于铅铜合金轴承和衬套中的铅。
11. Lead used in compliant pin connector systems.
顺应针连接器系统中的铅。
12. Lead as a coating material for the thermal conduction module c-ring.
用于热传导模块C-环的被覆材料中的铅。
13. Lead and cadmium in optical and filter glass.
用于光学及滤波器玻璃中的铅和镉。
14. Lead in solders consisting of more than two elements for the connection between the pins
and the package of microprocessors with a lead content of more
微处理器针脚及封装联接所使用的含两种以上组分的焊料中的铅（铅含量在80%与85%之 间）。
15. Lead in solders to complete a viable electrical connection between semiconductor die
and carrier within integrated circuit Flip Chip packages.
集成电路倒装芯片封装中半导体芯片及载体之间形成可靠联接所用焊料中的铅。
16. Lead in linear incandescent lamps with silicate coated tubes.
用于带有硅酸盐灯管的线型白炽灯中的铅。
17. Lead halide as radiant agent in High Intensity Discharge (HID) lamps used for
professional reprography applications.
用在专业复印领域高强度放电灯(HID)做激发介质中的卤素铅。
18. Lead as activator in the fluorescent powder (1 % lead by weight or less) of discharge
lamps when used as sun tanning lamps containing phosphors such asBSP (BaSi2O5:Pb) as
well as when used as speciality lamps for diazo- printingreprography, lithography,
insect traps, photochemical and curing processes containing phosphors such as SMS
((Sr,Ba)2MgSi2O7:Pb).
放电管的荧光粉中作为催化剂的铅（铅的重量小于等于1%）可以豁免，当放电管用于含有磷 元素
（如BSP (BaSi2O5:Pb)）的日晒灯时，以及用于重氮印刷、平板印刷、捕虫、光化学、 固化工艺
等等专业领域的灯具时。
19. Lead with PbBiSn-Hg and PbInSn-Hg in specific compositions as main amalgamand with
PbSn-Hg as auxiliary amalgam in very compact Energy Saving Lamps(ESL).
小型节能灯中作为主要汞合金的特定的PbBiSn-Hg 和PbInSn-Hg中的铅，以及作为辅助汞合金 的
PbSn-Hg中的铅。
20. Lead oxide in glass used for bonding front and rear substrates of flat fluorescent lamps
used for Liquid Crystal Displays (LCD).
LCD的平板荧光灯前后基板键合时所用玻璃中的铅。
21. Lead and cadmium in printing inks for the application of enamels onborosilicate glass.
用在硅硼玻璃表面瓷釉上的印刷油墨中的铅和镉；
22. Lead as impurity in RIG (rare earth iron garnet) Faraday rotators used for fibre optic
communications systems.
在光纤通讯系统中的稀土铁石榴石法拉第旋转器中的杂质铅；
23. Lead in finishes of fine pitch components other than connectors with a pitch of
0.65 mm or less with NiFe lead frames and lead in finishes of fine pitch components other
than connectors with a pitch of 0.65 mm or less with copper lead frames.
小螺距零部件表面处理中的铅（螺距不超过0.65mm且带镍铁边框的连接器，以及螺距不超过
0.65mm且带铜边框的连接器不在豁免之内）
24. Lead in solders for the soldering to machined through hole discoidal and planar array
ceramic multilayer capacitors.
通过盘状及平面陈列陶瓷多层电容器的焊料所含的铅；
25. Lead oxide in plasma display panels (PDP) and surface conduction electron emitter displays
(SED) used in structural elements; notably in the front and rear glass dielectric layer,
the bus electrode, the black stripe, the address electrode, the barrier ribs, the seal
frit and frit ring as well as in print pastes.
等离子显示屏（PDP）及表面传导式电子发射显示器（SED）构件中所用的氧化铅，特别是在 玻璃
前后绝缘层中所用的氧化铅、总线电极中的氧化铅、黑条（彩色显像管）中的氧化铅、 地址电极
中的氧化铅、阻挡层肋柱的氧化铅、密封玻璃料中的氧化铅，以及封装玻璃中的氧 化铅、环状玻
璃中的氧化铅、印墨中的氧化铅；
26. Lead oxide in the glass envelope of Black Light Blue (BLB) lamps.
黑蓝灯（BLB）玻璃封装中的氧化铅；
27. Lead alloys as solder for transducers used in high-powered (designated to operate for several
hours at acoustic power levels of 125 dB SPL and above) loudspeakers.
用作大功率扬声器（用在长时间操作125分贝以上的音响系统）的传感器中焊料的铅合金。
29. Lead bound in crystal glass as defined in Annex I (Categories1, 2, 3 and 4) of Council
Directive 69/493/EEC (*).
水晶玻璃中铅含量的限定依照欧盟指令69/493/EEC附件Ⅰ(第1、2、3、4类)。
30. Cadmium alloys as electrical/mechanical solder joints to electrical conductors located
directly on the voice coil in transducers used in high-powered loudspeakers with sound
pressure levels of 100 dB (A) and more.
用于位于音压级(SPL)大于或等于100 分贝的大功率扬声器音圈上的电导体的电气/机械焊点 的镉
合金。
31. Lead in soldering materials in mercury free flat fluorescent lamps (which e.g. are used
for liquid crystal displays, design or industrial lighting).
用于无汞平板荧光灯（例如：用于液晶显示器、设计或工业照明）的焊料中的铅。
32. Lead oxide in seal frit used for making window assemblies for Argon and Krypton laser
tubes.’
用于氩和氪激光管防护窗组合件的封装玻璃料里的铅的氧化物。
33. Lead in solders for the soldering of thin copper wires of 100 μm diameter and less in power
transformers.
电力变压器中直径100 微米及以下细铜线所用焊料中的铅
34. Lead in cermet-based trimmer potentiometer elements.
金属陶瓷质的微调电位计中的铅
35. Cadmium in photoresistance for photocoupler applied in professional audio equipment until
31 December 2009.
2009 年12 月31 日前专业音频设备的光耦合器中使用的光敏电阻的镉
36. Mercury used as a cathode sputtering inhibitor in DC plasma displays with a content up to
30 mg per display until 1 July 2010.
2010 年7 月1 日前直流等离子显示器中阴极溅射抑制剂中的汞，其含量不得超过30 毫克/显示器
37. Lead in the plating layer of high voltage diodes on the basis of a zinc borate glass body.
以硼酸锌玻璃体为基础的高压二极管的电镀层的铅
38. Cadmium and cadmium oxide in thick film pastes used on aluminium bonded beryllium oxide.
用氧化铍连接铝制成的厚膜浆料中镉和氧化镉
注： 1：依照欧盟决议2006/692/EC，第28条豁免项目将在2007年7月1日期中止。原第28条项目 为：用
于防腐或屏蔽电磁干扰，用在特定仪器设备中（欧盟指令2002/96/EC第三类规定 的IT和通讯
设备）的金属片或金属扣件上的防腐涂层中的六价铬。
2：2008年4月1日，欧洲法院（European Court of Justice）发布公告：欧盟委员会2005年 公布
的针对十溴二苯醚的豁免项目存在程序性的错误，因此废除委员会决议2005/717/EC 附件第9a
条对聚合物中十溴二苯醚的豁免，裁定将于2008年7月1日执行，因此聚合物中 十溴二苯醚的豁
免只能延续至2008年6月30日。
3：2009年6月5日，欧盟还刊登了2009/428/EC，从2011年1月1日起，将原豁免的第22点“光纤通
讯系统稀土铁石榴石法拉第旋转器中作为杂质的铅”从豁免列表中移除。
4：以上豁免项目，若中文译文与英文原文意思上不一致, 以英文原文为准。 有最新的標准條文嗎﹖
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